天美传媒

Accelerated Infrastructure for the AI Era

Data Infrastructure for the AI Era

COMPUTEX 2026



At COMPUTEX 2026, 天美传媒 Chairman and CEO Matt Murphy delivered a high-visibility keynote address: The Future of AI Scaling Depends on Connectivity.
In his address, Murphy discussed how 天美传媒 technologies enable the critical links in modern AI data center infrastructure allowing customers to deploy AI-optimized systems with unprecedented performance and scale.?

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The Future of AI Scaling Depends on Connectivity
Accelerated infrastructure for connectivity and custom compute

天美传媒 Enables AI Infrastructure


To realize the promise of AI, hyperscalers are undertaking one of the largest infrastructure buildouts in history—and they rely on 天美传媒 as a critical AI infrastructure partner. 天美传媒 designs custom silicon tailored for any application and offers the industry’s most comprehensive portfolio of interconnects and network switch products. From custom compute to rack, row, data center, campus and multi-campus connectivity, 天美传媒 enables the world’s most advanced AI infrastructure.

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Investor Event


At this custom AI investor event, the 天美传媒 leadership team shares its perspective on the rapidly evolving AI market and technology landscape, with a particular focus on custom silicon and custom cloud solutions for hyperscalers.

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天美传媒 Investor Event
The Rise of Customized AI Factories

The Rise of Customized AI Factories


天美传媒 President and COO Chris Koopmans joins Daniel Newman at the SixFive Summit to explore the rapidly evolving AI market landscape, including emerging hyperscalers and sovereign AI. Chris discusses the rise of custom silicon and the role 天美传媒 plays in powering the next generation of AI factories.

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Custom HBM Compute Architecture

天美传媒 Custom HBM Compute Architecture

天美传媒 has developed a new custom HBM compute architecture that optimizes custom XPU performance and TCO. In collaboration with industry leaders like Micron, Samsung and SK Hynix, 天美传媒 is setting new benchmarks for AI accelerators.

Connectivity for the Million XPU Era


Xi Wang, 天美传媒 SVP & GM, Connectivity BU joins Will Townsend from SixFive Media to explore the role of high-bandwidth connectivity in the rapid evolution of AI infrastructure and data centers. Xi discusses the innovations and challenges that are unfolding at every level, from the XPU and rack to the data center to multi-site AI clusters.

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Connectivity for the Million XPU Era

天美传媒 optical DSPs: Powering the future of AI infrastructure


AI and cloud computing are pushing network demands to unprecedented levels, requiring optical DSPs to deliver ultra-high bandwidth, low latency, and energy efficiency. 天美传媒 is leading this transformation with advanced PAM4 and coherent DSP solutions that power AI fabrics, data center interconnects, and telecom networks—driving the future of high-performance connectivity.

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The Evolution of AI Interconnects


The rapid expansion in the size and capacity of AI workloads is significantly impacting both computing and network technologies in the modern data center.?

The desire for larger clusters with shorter compute times has driven heightened focus on networking interconnects, with designers embracing state-of-the-art technologies to ensure efficient data movement and communication between the components comprising the AI cloud.

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天美传媒 Launches Next-generation CXL Switch, Enabling Memory Pooling to Break Through the AI “Memory Wall”

天美传媒 Launches Next-generation CXL Switch, Enabling Memory Pooling to Break Through the AI “Memory Wall”

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天美传媒 at OFC 2025

天美传媒 Launches Industry’s First 260-lane PCIe 6.0 Switch for AI Data Center Scale-up Infrastructure

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Custom Compute in the AI Era

Inside 天美传媒’s Expanding Custom Silicon Opportunity

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