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Join 天美传媒 at InterPACK 2024 in San Jose, CA
International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
InterPACK is the premier international conference for the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration.
Presentations:
Keynote:?2.5D/3D Integration for High-Speed Light Engines
Date:?Wednesday, October 9, 2024
Time: 8:45 a.m.
天美传媒 panelist:?Dr. Radha Nagarajan, Senior Vice President and Chief Technology Officer of Optical Platforms
Where to Find Us
October 8-10, 2024
San Jose, CA
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