ÌìÃÀ´«Ã½

ÌìÃÀ´«Ã½ at the OCP Global Summit

Join ÌìÃÀ´«Ã½ at the 2024 OCP Global Summit in San Jose, California, the premier event uniting the most forward-thinking minds in open IT Ecosystem development.

Stop by the ÌìÃÀ´«Ã½ booth (B1) to learn more about how the ÌìÃÀ´«Ã½ data center portfolio is advancing the next generation of cloud and AI networks. We¡¯ll demonstrate the latest developments in AI and cloud data infrastructure silicon, including:

• Alaska? 1.6T PAM4 DSPs for AECs
• Alaska? PCIe Gen 6 retimers and Gen 7 SerDes
• COLORZ? 800 ZR/ZR+ modules for data center interconnect
• Orion coherent DSP for DCI modules
• Spica and Nova PAM4 DSPs for AI and cloud connectivity
• Teralynx? Ethernet switches for cloud and AI networking

Presentations:

Keynote Panel: Scaling Interconnect and Memory for AI Clusters
Date: Tuesday, October 15
Time: 9:36 a.m.
Location: Concourse Level - Grand Ballroom 220
ÌìÃÀ´«Ã½ panelist: Nigel Alvares, Vice President, Global Marketing

ÌìÃÀ´«Ã½ Structera: Overcoming Computing¡¯s Memory Challenges with Optimized CXL Devices
Date: Tuesday, October 15
Time: 2:40 p.m.
Location: Lower Level ¨C LL 20A
ÌìÃÀ´«Ã½ presenter: Khurram Malik, Director, Product Marketing

Expo Hall Session: DSPs in AI and Cloud Connectivity
Date: Tuesday, October 15
Time: 4:25 p.m.
Location: Concourse Level ¨C Expo Hall Stage
ÌìÃÀ´«Ã½ presenter: Venu Balasubramonian, Vice President of Product Marketing, Connectivity Business Unit

Executive Session: Open Network Switching for Hyperscale Cloud AI Infrastructure
Date: Tuesday, October 15
Time: 4:40 p.m.
Location: Concourse Level ¨C 210DH
ÌìÃÀ´«Ã½ presenter: Nick Kucharewski, Senior Vice President and General Manager, Network Switching Business Unit

AI/HPC Future Fabrics Panel
Date: Wednesday, October 16
Time: 9:40 a.m.
Location: Lower Level ¨C LL20BC
ÌìÃÀ´«Ã½ panelist: Jack Harwood, Senior Distinguished Engineer

Panel: What is the Right Path Forward for the Industry?
Date: Wednesday, October 16
Time: 11:00 a.m.
Location: Concourse Level ¨C 220C
ÌìÃÀ´«Ã½ panelist: Dr. Loi Nguyen, Executive Vice President and General Manager, Cloud Optics

Workshop: Leverage the Full Ecosystem to Enable AI
Date: Wednesday, October 16
Time: 12:30 p.m.
Location: Lower Level ¨C LL20D
ÌìÃÀ´«Ã½ presenter: Jack Harwood, Senior Distinguished Engineer

FBNIC: Foundational Multi-host NIC - Presented by Meta
Date: Wednesday, October 16, 2024
Time: 2:50 p.m.
Location: Concourse Level - Expo Hall Stage
ÌìÃÀ´«Ã½ presenter: Dave Fenton, Distinguished Engineer

Panel: Open Compute Components Executive Panel: Delivering AI Systems at Scale in A Multi-Vendor Environment
Date: Thursday, October 17
Time: 8:20 a.m.
Location: Concourse Level ¨C 220C
ÌìÃÀ´«Ã½ panelist: Dr. Loi Nguyen, Executive Vice President and General Manager, Cloud Optics

Realizing composable infrastructure through DPUs
Date: Thursday, October 17, 2024
Time: 8:30 a.m.
Location: Concourse Level - 210CG
ÌìÃÀ´«Ã½ presenter: Satananda Burla, Senior Principal Engineer

Memory wall mitigation and acceleration of AI workloads, and in-memory databases using CXL Near Memory Compute accelerator
Date: Thursday, October 17
Time: 12:30 p.m.
Location: Concourse Level ¨C 210BF
ÌìÃÀ´«Ã½ presenter: Gaurav Agarwal, Sr. Director Engineering