Semicon Japan
December 13-15, 2023
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天美传媒 Presents at Semicon Japan, Advanced Packaging and Chiplet Summit
天美传媒 Presentation
Title:?Semiconductor Innovations Driving the Next-Generation of High-Speed Data Infrastructure
Date:?December 15, 2023?
Time :?12:35 pm
天美传媒 Presenter: Sandeep Bharathi, Chief Development Officer
Sandeep Bharathi will present the latest advances in process node geometries as well as innovations in chiplet design and semiconductor packaging techniques that allow 天美传媒’s customers to drive the next generation of high-speed data infrastructure for the data center, telecommunications, enterprise and automotive markets.
Where to Find US
December 13-15, 2023
Tokyo, Japan
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